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1Semiconductor Frontier Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba Central 2, 1-1-1 Umezono, Tsukuba, Ibaraki 305–8568, Japan
2NEC-AIST Quantum Technology Cooperative Research Laboratory, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba Central 2, 1-1-1 Umezono, Tsukuba, Ibaraki 305–8568, Japan
Ferroelectric HfO2 is attractive for next-generation devices because it retains ferroelectricity in nanometer-scale films and is compatible with semiconductor processing. Most reports ascribe ferroelectricity to a metastable orthorhombic (Pca21) phase stabilized by oxygen vacancies, and vacancy migration under electric field is regarded as the origin of remanent-polarization instability (wake-up, fatigue). This study introduces a design strategy for vacancy-independent ferroelectricity: valence-complementary codoping. Substituting Hf4+ with equimolar Y3+ and Nb5+ (6% each) maintains the average cation valence at 4 + while intentionally creating local charge inhomogeneity that induces internal fields and lattice strain to stabilize a ferroelectric phase. The resulting Y0.06Nb0.06Hf0.88O2 (YNHO) is identified as noncentrosymmetric tetragonal P4mm by transmission electron microscope, electron diffraction, and grazing-incidence X-ray diffraction. The tetragonal phase persists after annealing in air at 600°C for 100 h, indicating near-thermodynamic stability. TaN/YNHO/TaN capacitors endure 1010 polarization-switching cycles at 3.3 MV cm− 1 without detectable wake-up or fatigue, indicating that polarization stability does not rely on vacancy migration. Unlike Pca21 ferroelectric HfO2, P4mm YNHO contains no non-polar sublayers (spacers), suggesting a distinct ferroelectric HfO2. These findings suggest valence-complementary codoping as a practical strategy for realizing intrinsically reliable ferroelectric HfO2 and outline a pathway to next-generation logic and memories.
Ferroelectric HfO2 has attracted considerable attention as a promising platform for high-density nonvolatile electronics, as it allows polarization switching even in nanometer-scale thin films while remaining compatible with advanced CMOS process flows1,2. In particular, ferroelectric FETs (FeFETs) are regarded as promising devices for in-memory computing architectures suited to machine learning applications, driving active research efforts toward the practical implementation of HfO₂-based ferroelectrics3.
Most reports indicate that ferroelectricity in doped HfO2 arises from a polar orthorhombic (Pca21) phase that is metastable with respect to the monoclinic (P21/c) ground state4–6. However, because oxygen vacancies are highly mobile, they migrate and redistribute under an electric field, inducing field-driven phase transitions between the monoclinic and orthorhombic phases7–15. The resulting changes in remanent polarization—manifested as wake-up and fatigue—pose a critical reliability challenges for capacitors and transistors utilizing ferroelectric HfO2. Therefore, whether HfO2 can exhibit robust ferroelectricity independent of oxygen vacancies, with polarization stability decoupled from defect chemistry, remains an important question.
Here, we propose a new design strategy to stabilize a ferroelectric phase of HfO2 without relying on oxygen vacancies. We adopt a valence-complementary codoping approach, in which Hf4+ sites are substituted with paired acceptor–donor cations to maintain an average cation valence of 4+, while introducing local charge inhomogeneity. This suppresses the net charge imbalance that would otherwise require compensation by oxygen vacancies, while deliberately creating local charge inhomogeneity. This approach is inspired by perovskite relaxor ferroelectrics, where mixed B-site valences generate random local electric fields and nanoscale polar order16–19. We hypothesize that charge disorder in HfO2 could give rise to internal electric fields and lattice distortions, thereby stabilizing a polar structure independently of oxygen vacancies. Unlike oxygen vacancies, cations do not readily migrate under an electric field. Therefore, if a ferroelectric phase can be stabilized by cation-induced internal fields, it is expected to exhibit robust ferroelectricity.
In perovskite-type oxides, the effects of valence-complementary codoping on physical properties —such as the relaxor characteristics—have been investigated. In contrast, little research has been conducted on how valence-complementary codoping influences binary oxides. Recently, studies on ferroelectric HfO2 have begun to draw attention to valence-complementary codoping; however, these investigations have primarily focused on the suppression of oxygen vacancies and have not examined the impact of local charge inhomogeneity as observed in relaxor ferroelectrics20–23.
In this study, we sought to induce ferroelectricity in HfO2 by codoping Y3+ and Nb5+ in equimolar proportions (6% each), thereby introducing local charge inhomogeneity. Y and Nb were selected to provide strong valence complementarity while maintaining chemical compatibility with the fluorite lattice and keeping the average cation radius close to that of Zr. The total doping concentration of Y and Nb was set to 12% (approximately 1/8), because this corresponds to about one dopant per two fluorite-type HfO2 unit cells, which is expected to generate a moderate local electric field.
We show that Y0.06Nb0.06Hf0.88O2 (YNHO) adopts a noncentrosymmetric tetragonal P4mm structure and exhibits robust ferroelectric switching. The tetragonal phase persists after prolonged annealing in air at 600°C for 100 h, indicating near thermodynamic stability. Electrical measurements show that YNHO capacitors withstand 1010 cycles without detectable wake-up or fatigue, consistent with a reduced role of oxygen vacancies in polarization evolution. Together, these results establish a vacancy-independent route to ferroelectricity in HfO2 and define a generalizable design principle—valence-complementary codoping—for intrinsically reliable ferroelectric materials. In the remainder of the paper, we describe the structural identification of the P4mm phase, the stability of the ferroelectric phase, the exceptional endurance of YNHO, and benchmarking against state-of-the-art HfO2-based ferroelectrics.
Structural Analysis using Transmission Electron Microscopy
Transmission electron microscopy (TEM) was used to examine YNHO/TaN/n-Si and TaN/YNHO/TaN/n-Si structures and to analyze the YNHO lattice.
For the YNHO/TaN/n-Si sample, YNHO and TaN thicknesses were 45 nm and 10 nm, respectively. Crystallization was performed by annealing at 600°C for 10-min in Ar + O
2 (21%) at 1 atm, followed by slow cooling at 6°C min
− 1 (see the Experimental Section/Methods). Figure 1a–d shows cross-sectional annular bright-field scanning transmission electron microscopy (ABF-STEM) images; the corresponding high-angle annular dark-field scanning transmission electron microscopy (HAADF-STEM) images are in the
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Supporting Information, Fig. S2b, d, f, h. Figure 1b,c are higher-magnification views of the red-marked regions in Fig. 1a,b, and Fig. 1d further enlarges the area in Fig. 1c. As seen in Fig. 1a, the TaN film delaminated from the substrate, attributed to volume expansion from oxygen incorporation during annealing and formation of TaO
xN
y; oxygen in the bottom TaN was confirmed by XPS depth profiling (Supporting Information Fig. S1). In Fig. 1b, the YNHO lattice is aligned from surface to TaN interface without dislocations; the undistorted region extends over 40 nm laterally, indicating grains exceeding ~ 40 nm × 40 nm (also see the Supporting Information Fig. S2e). Similar low dislocation density has been reported for La
3+/Ta
5+-codoped HfO
2, suggesting suppression of oxygen-vacancy formation
20.
Figure 1c is a processed high-magnification ABF-STEM image with nonperiodic noise removed (raw image: Supporting Information Fig. S2g). It indicates a noncentrosymmetric YNHO structure; for further analysis, Fig. 1d is used. In Fig. 1d, larger circles denote Hf, Y, and Nb, and smaller circles denote O. Atomic positions show vertical asymmetry in Hf(Y,Nb)–O distances, indicating absence of inversion symmetry along the vertical axis, while lateral positions are symmetric. Figure 1c also indicates the absence of a glide plane and screw axis. Among noncentrosymmetric space groups with mirror planes but without glide planes or screw axes, thirteen are possible: Pm, Cm, Pmm2, Cmm2, Amm2, Fmm2, Imm2, P4mm, I4mm, P3m1, P31m, R3m, and P6mm24. Since it is unlikely for the fluorite structure to transform into trigonal or hexagonal phases, these can be excluded from the candidates. As will be discussed later, the grazing-incidence X-ray diffraction (GI-XRD) results indicate that the possibilities of monoclinic, rhombohedral, and orthorhombic symmetries are unlikely, narrowing the candidate space groups for YNHO to I4mm and P4mm. Further narrowing of the space group is carried out later using electron diffraction.
For the TaN/YNHO/TaN/n-Si structure, YNHO and TaN layers were 18 nm and 10 nm. Crystallization was achieved by annealing at 600°C for 1 and 10-min in N2 at 1 atm, followed by natural cooling. Before TEM, this sample underwent endurance measurements to 109 cycles using 6 V, 100 kHz square pulses (P–E and endurance are discussed later). Figure 1e,f shows high-magnification ABF-STEM images (Fig. 1f enlarges the red-marked region in Fig. 1e); additional ABF-STEM and HAADF-STEM images are in the Supporting Information Fig. S3a–h. In Fig. 1f, the red lines serve as auxiliary guides to verify that the oxygen atoms are arranged within the same plane. Because the pattern in Fig. 1f matches Fig. 1d, the same space group is preserved after annealing with top-electrode and electrical stress.
Figure 1g shows the electron diffraction pattern along [110] (fluorite unit-cell assumption) from the sample in Fig. 1e,f. Figure 1h presents simulated patterns for I4mm and P4mm; atomic positions and parameters are in the Supporting Information section 3. The beam-exposed region is shown in the Supporting Information Fig. S3a. Comparing experiment and simulation, I4mm does not reproduce the dark spots indicated by white arrows in Fig. 1g, whereas P4mm reproduces the spots marked by red circles. On this basis, YNHO is estimated to be P4mm.
Figure 1i shows EDX mapping of YNHO in TaN/YNHO/TaN/n-Si annealed at 600°C for 1-min. Panels (top-left to bottom-right) display the HAADF-STEM image and maps for Hf, O, Y, Nb, and Y + Nb. Y and Nb are uniformly distributed with no discernible pattern.
Based on these results, approximate atomic positions rendered in VESTA are shown in Fig. 1j25. Ochre spheres represent Hf(Y,Nb) and red spheres represent O. Because YNHO is tetragonal, the unit cell differs from the conventional fluorite cell and corresponds to the red-outlined cell in the top panel of Fig. 1j; side and oblique views are shown below. A distinctive feature is that, unlike tetragonal HfO2 (P42/nmc), oxygen atoms aligned horizontally lie on the same plane26. As in Fig. 1d,f, the two oxygen planes are shifted in the same direction from the quarter-point along the c-axis, and the apparently body-centered Hf(Y,Nb) atoms are slightly displaced along c-axis. If Hf(Y,Nb) were exactly at the body center, their scattering would cancel that of the corner atoms and the dark spots in Fig. 1g would not appear. A bias in Y/Nb distribution could also cause contrast even for body-centered positions, but Fig. 1i shows uniform Y and Nb distribution, making this unlikely. These observations indicate that displacement of the oxygen planes and near-body-centered Hf(Y,Nb) shifts the centers of negative and positive charges, producing spontaneous polarization; its precise magnitude was not determined here and requires further study.
Structural Analysis using X-ray Diffraction
Next, GI-XRD measurement was performed on TaN/YNHO/TaN/n-Si and YNHO/TaN/n-Si to analyze the YNHO structure. YNHO and TaN thicknesses were 45 nm and 10 nm; preparation details are in the Experimental Section/Methods. Figure 2a shows the profile of a TaN/YNHO/TaN/n-Si sample annealed in 1 atm N2, Fig. 2b that of YNHO/TaN/n-Si under the same conditions, and Fig. 2c that of YNHO/TaN/n-Si annealed in 1 atm Ar + O2 (21%). Annealing temperatures, durations, and cooling conditions are listed to the right of Fig. 2c. No crystallization occurred at 400°C, whereas samples annealed at ≥ 500°C crystallized. In crystallized films, a peak appears near 30.5°, assignable to the (111) reflection of the orthorhombic/cubic phases or the (011) reflection of the tetragonal phase, while intensities near 28.5° and 31.5°—monoclinic (111) and (− 111)—are negligible. If YNHO were rhombohedral, d111 and d11 − 1 would differ in both length and multiplicity, and the (111) or (11 − 1) peaks around 30.5° should therefore split into two or appear as an asymmetric peak. However, since the peaks in Fig. 2a–c are all single and symmetric, the possibility of a rhombohedral structure is unlikely. Figure 2d shows the (113), (131), and (311) orthorhombic/cubic or (103), (013), (121), and (211) tetragonal reflections for a sample annealed at 600°C for 10-min in Ar + O2 (21%) and slowly cooled at 6°C min− 1. First, the TEM results indicate that YNHO is not cubic, thereby excluding the cubic phase from consideration. Next, if YNHO were orthorhombic, d311, d131, and d113 would have the same multiplicity but different lengths, and the (311), (131), and (113) reflections should therefore split into three peaks of comparable intensity. In contrast, for the tetragonal case, the multiplicity of d211 is twice that of d103, so the (103), (013), (211), and (121) reflections should form two peaks with an intensity ratio of approximately 2:1. From the peak shape in Fig. 2d, the feature can be interpreted as two overlapping peaks with an intensity difference of about a factor of two, making it reasonable to conclude that YNHO is tetragonal rather than orthorhombic. Assuming two overlapping peaks, fitting gives positions at 59.95° and 60.34°. From these, the lattice parameters of the unit cell in Fig. 1j are a ≈ 3.59 Å and c ≈ 5.12 Å (fitting details in the Supporting Information section 4). Together with TEM and electron diffraction, these results indicate tetragonal P4mm formation under the employed annealing conditions, with minimal monoclinic content.
The profile for Ar + O2 (21%) is noteworthy because oxygen-containing anneals in prior ferroelectric HfO2 studies typically produce monoclinic or cubic phases (and, rarely, an antiferroelectric tetragonal phase)27–31. Since YNHO nevertheless crystallizes into tetragonal P4mm after Ar + O2 (21%) annealing, oxygen vacancies are not required to stabilize the ferroelectric phase in YNHO.
The topmost profile in Fig. 2c corresponds to the Fig. 1a–d sample annealed at 600°C and slowly cooled at 6°C min− 1; monoclinic peaks are scarcely observed, suggesting the P4mm phase is not a quenched metastable state. Collectively, these data indicate that tetragonal (P4mm) YNHO is more stable than the metastable ferroelectric Pca21 phase reported for other ferroelectric HfO2.
To further test this, GI-XRD was measured for YNHO/TaN/n-Si annealed in 1 atm air (N2 + O2) at 500–600°C for 10–100 h, followed by slow cooling at 0.5°C min− 1 (Fig. 2e). For all samples, monoclinic peak intensities increased relative to 10-min anneals, yet the most intense peak remained near 30.5°, characteristic of the tetragonal phase, indicating a substantial tetragonal fraction even after 100 h. Annealing at 600°C for 100 h produces a larger monoclinic fraction than at 10 h; likewise, 100 h at 600°C yields more monoclinic content than at 500°C. Thus, while the monoclinic phase is thermodynamically stable, the tetragonal phase is sufficiently stable to remain dominant after prolonged annealing, i.e., nearly thermodynamically stable phase.
Evaluation of Ferroelectric Properties
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Next, we present ferroelectric property evaluations of YNHO films. Figure 3a–d shows P–E hysteresis, I–V curves, positive-up-negative-down (PUND) measurements, and endurance for a TaN/YNHO/TaN/n-Si structure annealed at 600°C for 1-min in N
2 and naturally cooled. Similarly, Fig. 3e–h presents the same measurements for a sample annealed at 600°C for 10-min in N
2 and naturally cooled. In both cases, the YNHO layer was 18 nm thick; the applied voltage was up to 6 V (3.3 MV cm
− 1). Measurement procedures and leakage-current data are provided in the Experimental Section/Methods, and Supporting Information section 5. The endurance in Fig. 3d,h was derived from remanent polarization (
Pr) obtained by the PUND signals in Fig. 3c,g. The 10-min sample is the same as that used for TEM and electron diffraction in Fig. 1e–g.
Although overlapping and visually difficult to distinguish, Fig. 3a–c includes results from 1 to 1010 cycles. Measurement stopped at 1010 cycles due to system constraints; the sample remained operational. The P–E loops, I–V curves, and PUND responses are essentially unchanged from the first to the 1010th cycle. The 1-min sample shows Pr ≈ 11.4 µC cm− 2 at 3.3 MV cm− 1 (Fig. 3c), indicating stable endurance without wake-up or fatigue over 1010 cycles.
Similarly, Fig. 3e,f shows results from 1 to 109 cycles. Measurement was stopped at 109 cycles as a precaution because this sample was intended for TEM observation before breakdown. Compared with the 1-min sample, slight changes appear in P–E and I–V shapes with cycling, whereas the PUND signal remains essentially unchanged, suggesting that the variations arise outside the ferroelectric regions. The 10-min sample shows Pr ≈ 15.6 µC cm− 2 (Fig. 3g) and endurance without wake-up or fatigue (Fig. 3h). These results indicate that an electric field of 3.3 MV cm-1 does not induce ferroelectric–paraelectric phase transitions in YNHO.
To evaluate endurance stability, benchmarking was performed. Figure 3i compiles Max and Min Pr for polycrystalline HfO2-based ferroelectric films reported to exceed 1010 cycles under fields ≥ 2.5 MV cm− 1; the horizontal axis is Min Pr and the vertical axis is Max Pr. Data were estimated from endurance plots of La-doped Hf0.5Zr0.5O2, V-doped HfO2, SiO2/Hf0.7Zr0.3O2, Ga-doped HfO2, HfO0.61N0.72/Hf0.5Zr0.5O2, Hf0.5Zr0.5O2, ZrO2/Hf0.5Zr0.5O2, and Ca-doped Hf0.5Zr0.5O24,5,32–39. The black dotted line denotes Max Pr = Min Pr; red, blue, and green dotted lines mark Min Pr = 95%, 90%, and 80% of Max Pr. The YNHO values from Fig. 3d (Max Pr = 11.76 µC cm− 2, Min Pr = 11.35 µC cm− 2) lie to the right of the 95% line, indicating high stability.
The P–E and PUND results in Fig. 3a,c,e,g exhibit “slanted” or “sheared” hysteresis40–42. A discussion of possible causes is provided in the Supporting Information section 6.
Discussion
On the basis of the results reported thus far, although the ferroelectric phase of YNHO is not the thermodynamic ground state, it is sufficiently close in stability and can exist without oxygen vacancies. We next relate this observation to the improved endurance of YNHO.
Ferroelectricity in HfO2 codoped with La3+ and Ta5+ (La0.02Ta0.02Hf0.96O2) has been reported in Ref. 20. In that study (and its Supplementary Information), it was noted that dislocation formation was suppressed due to a reduction in oxygen vacancies. However, the crystal structure remained orthorhombic, and both wake-up and fatigue were observed. These findings suggest that suppressing oxygen vacancies alone is insufficient to fundamentally resolve the issues of wake-up and fatigue.
In contrast, wake-up and fatigue are suppressed in YNHO, and the underlying reasons may be interpreted as follows. For YNHO, peaks at angles corresponding to the tetragonal phase appear irrespective of annealing atmosphere (Fig. 2b,c), indicating that small variations in oxygen-vacancy content have little effect on the crystal structure. Even if vacancies migrate under an applied voltage, such changes do not trigger transitions between the ferroelectric and paraelectric phases. These results indicate that, to achieve stable endurance, forming a ferroelectric phase that does not undergo vacancy-driven phase transitions is more important than merely suppressing vacancy formation or migration. The differences in properties between La0.02Ta0.02Hf0.96O2 and YNHO are presumed to arise from factors such as dopant concentration and the covalent radii of the dopant elements, although further investigation is needed to clarify the underlying mechanisms.
A remarkable and essential effect of valence-complementary codoping is that it does not merely stabilize a known metastable phase, but rather enables near-stabilization of a previously unreported ferroelectric phase in HfO2-based systems. This distinction is not limited to the crystal structure. As noted in Refs. 43 and 44, in orthorhombic (Pca21) HfO2, only half of the unit cells exhibit oxygen-ion displacement, resulting in a layered configuration composed of ferroelectric and non-ferroelectric subunits. This gives rise to a two-dimensional polar state characterized by alternating polar and non-polar sublayers (spacers). In contrast, YNHO adopts the P4mm structure, similar to BaTiO3, and thus contains no such non-ferroelectric subunits. Moreover, while conventional ferroelectrics such as BaTiO3 exhibit spontaneous polarization primarily through cation displacement, ferroelectricity in HfO2-based systems arises mainly from oxygen displacement. As previously mentioned, YNHO exhibits spontaneous polarization primarily arising from oxygen displacement, similar to other ferroelectric HfO2. These findings indicate that YNHO is distinct from both ferroelectric HfO2 and conventional ferroelectrics, exhibiting characteristics that lie between the two. These results indicate that valence-complementary codoping stabilizes the ferroelectric phase through a mechanism fundamentally distinct from single-dopant strategies that stabilize the metastable orthorhombic phase.
Furthermore, valence-complementary codoping can be achieved solely by adjusting the composition ratio, without the need for specialized equipment or techniques. As such, it is readily compatible with existing structural designs and process technologies for ferroelectric random-access memory, ferroelectric tunnel junctions, and FeFETs, making it a strategy with a low barrier to implementation.
We demonstrate that valence-complementary codoping of Y3+ and Nb5+ in HfO2 stabilizes a polar tetragonal P4mm phase without requiring oxygen vacancies. The resulting Y0.06Nb0.06Hf0.88O2 films exhibit robust ferroelectric switching and endurance up to 1010 cycles without wake-up or fatigue, with structural stability confirmed via TEM, GI-XRD, and ferroelectric properties measurement. This vacancy-independent route circumvents the reliability issues associated with field-driven vacancy migration in ferroelectric HfO2. Our results provide a generalizable design strategy for stable ferroelectric HfO2 via local charge inhomogeneity, compatible with ferroelectric memory applications.
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Figure Legends
Figure 1. Structural characterization of YNHO thin films using cross-sectional TEM, electron diffraction, EDX mapping, and structural modeling.
a–d Cross-sectional ABF-STEM images of YNHO/TaN/n-Si samples annealed at 600°C for 10-min in Ar + O2 (21%), followed by slow cooling at 6°C min− 1. b–d show progressively higher magnification views of the boxed regions in a–c, respectively. d The ochre-colored circles represent Hf(Y, Nb), whereas the red circles represent oxygen. The distances from Hf (Y, Nb) to the oxygen atoms above and below are different, indicating a lack of centrosymmetry in the vertical direction. e, f High-resolution ABF-STEM images of TaN/YNHO/TaN/n-Si samples annealed at 600°C for 1-min in N2 after electrical cycling (109 pulses at 6 V, 100 kHz). The boxed area in e is enlarged in f, showing structural similarity to d, indicating preservation of symmetry under electrical stress. g Experimental electron diffraction pattern along the [110] zone axis from the same sample. h Simulated electron diffraction patterns for candidate space groups (I4mm and P4mm). Only the P4mm simulation reproduces the characteristic spots (red circles), confirming the space group. i EDX elemental maps showing the uniform distributions of Hf, O, Y, and Nb. j Atomic model of the YNHO unit cell. The area outlined in red in the top panel indicates the outline of the unit cell, with side and oblique views of the unit cell shown below. The two oxygen planes are displaced in the same direction from the quarter position along the c-axis, and the Hf(Y, Nb) atoms near the body center are also slightly shifted along the c-axis, resulting in net spontaneous polarization along the c-axis.
Figure 2. Structural analysis of YNHO thin films by grazing incidence X-ray diffraction (GI-XRD).
a–c GI-XRD profiles of TaN/YNHO/TaN/n-Si and YNHO/TaN/n-Si samples annealed under different atmospheres (N2 or Ar + O2 (21%)) at temperatures ranging from 400°C to 600°C and as-deposited samples. Crystallization occurs at ≥ 500°C, with dominant peaks near 30.5°, corresponding to the (011) reflection of the tetragonal P4mm phase. Peaks from the monoclinic phase are negligible, even after annealing in an oxygen atmosphere. d High-angle region of the GI-XRD profile for the sample annealed at 600°C for 10-min in Ar + O2 (21%) followed by slow cooling at 6°C min− 1. Diffraction peaks attributed to the (103)/(013) and (121)/(211) planes of the tetragonal phase, yielding lattice constants of a ≈ 3.59 Å and c ≈ 5.12 Å, were observed. e GI-XRD profiles of YNHO/TaN/n-Si samples annealed in air at 500°C or 600°C for 10 to 100 h. While the monoclinic phase intensity gradually increases with increasing annealing time and temperature, the tetragonal P4mm phase remains dominant.
Figure 3. Ferroelectric properties and endurance of YNHO thin films.
a–d P–E hysteresis loops (a), I–V characteristics (b), PUND measurements (c), and endurance performance (d) of a TaN/YNHO/TaN/n-Si capacitor (18 nm YNHO) annealed at 600°C for 1-min in N2. a–c Overlaid plots from the first cycle to the 1010th cycle. Stable remanent polarization (~ 11.4 µC cm− 2) is maintained over 1010 cycles without wake-up or fatigue. e–h Corresponding measurements for a sample annealed at 600°C for 10-min. e–g Overlaid plots from the first cycle to the 109th cycle. Stable remanent polarization (~ 15.6 µC cm− 2) is maintained over 109 cycles without wake-up or fatigue. i Maximum (Max) and minimum (Min) values of the remanent polarization (Pr) for polycrystalline HfO2-based ferroelectric films exhibiting endurance characteristics beyond 1010 cycles under applied electric fields ≥ 2.5 MV cm− 1. The horizontal axis represents Min Pr, and the vertical axis represents Max Pr, with data estimated from endurance plots reported for La-doped Hf0.5Zr0.5O24, V-doped HfO25, SiO2/Hf0.7Zr0.3O232, Ga-doped HfO233, HfO0.61N0.72/Hf0.5Zr0.5O234, Hf0.5Zr0.5O235–37, ZrO2/Hf0.5Zr0.5O238, and Ca-doped Hf0.5Zr0.5O239. The black dotted line corresponds to Max Pr = Min Pr. The red, blue, and green dotted lines represent cases where the Min Pr is 95%, 90%, and 80%, respectively, of the Max Pr; the data points to the right of each line satisfy these conditions. The Max Pr (11.76 µC cm− 2) and Min Pr (11.35 µC cm− 2) values determined from Fig. 3d for YNHO are indicated by a star symbol in Fig. 3i.
Experimental Section/Methods
Film Deposition
The YNHO thin films were deposited using a sputtering system (ULVAC, Model: BC4967). Heavily doped n-type Si(100) wafers (2-inch, resistivity < 0.005 Ω cm) were used as substrates. A custom-made ceramic target (Kojundo Chemical Lab. Co., Ltd.) was fabricated by mixing Y2O3, Nb2O5, and HfO2 powders in a molar ratio of Y:Nb:Hf = 0.06:0.06:0.88, followed by sintering at temperatures exceeding 1200°C. The deposition was carried out under an Ar atmosphere at a pressure of 1.1 mTorr, with the substrate maintained at room temperature and an RF power of 50 W. Prior to deposition, reverse sputtering was performed for 1-min to remove the native oxide layer on the Si substrate. First, a 10 nm- or 20 nm-thick TaN bottom electrode was deposited. Second, a YNHO layer with a thickness of 20 to 50 nm was deposited, followed by a 10 nm- or 20 nm-thick TaN top electrode without breaking vacuum, forming a metal‒insulator‒metal (MIM) structure. The film thicknesses mentioned above were based on the deposition rate measured prior to annealing by using a probe-type step height gauge. Therefore, the film thickness is reduced by several percent after crystallization annealing.
Crystallization Annealing
The samples for X-ray diffraction measurement were prepared by dicing 2-inch Si substrates with TaN (10 nm)/YNHO (50 nm)/TaN (10 nm) films into 12 mm × 12 mm squares using a dicing saw, followed by crystallization annealing using a benchtop rapid thermal annealing system (MILA-3000, ADVANCE RIKO, Inc.).
For the samples used to evaluate the effect of stress from the top TaN layer, annealing was performed with the above structure. The samples were loaded into the annealing chamber, evacuated, and then purged with N2 gas at a flow rate of 100 sccm to maintain a pressure of 1 atm. After an N2 atmosphere was established, the temperature was increased to 100°C at a rate of 2°C s− 1 and held for 60 s. The temperature was then increased to the annealing temperature (400–600°C) at 5–12°C s− 1 and maintained for 10-min. After annealing, the samples were naturally cooled to 80°C under a N2 atmosphere before removal.
For the samples used to investigate the effect of the annealing atmosphere, the top TaN layer was removed by reactive ion etching (RIE) (RIE-200L, Samco Inc.) using CF4 gas prior to annealing, exposing the YNHO film directly to the annealing atmosphere. The samples annealed in N2 were then subjected to the same annealing process as described above.
For samples annealed in an Ar + O2 (21%) atmosphere, the top TaN layer was also removed by RIE prior to annealing. The samples were loaded into the chamber, and the atmosphere was replaced with Ar + O2 (21%) gas at a flow rate of 100 sccm to maintain a pressure of 1 atm. The temperature was increased to 100°C at 2°C s− 1, held for 60 s, then further increased to the annealing temperature (400–600°C) at 5–12°C s− 1 and maintained for 10-min. After annealing, the samples subjected to rapid cooling were naturally cooled to 80°C under the same atmosphere before removal, whereas those subjected to slow cooling were cooled at 6°C min− 1 to room temperature prior to removal.
For X-ray diffraction analysis of YNHO thin films subjected to long-term annealing in an oxygen atmosphere, samples without the top TaN layer were annealed in air using an electric furnace (FT-105FM, FULL-TECH CO., LTD). The samples were placed in the furnace, heated to 100°C at a rate of approximately 1°C s− 1, and held for 60 s. The samples were then further heated to the annealing temperature (400–600°C) at 15–25°C min− 1 and maintained for 10 to 100 h. After annealing, the samples were slowly cooled to room temperature at 0.5°C min− 1 before removal.
The samples for ferroelectric property measurements were crystallization-annealed by placing 2-inch Si substrates with TaN (10 nm)/YNHO (20 nm)/TaN (10 nm) films into a variable-atmosphere lamp annealing system (QHC-P610S, ADVANCE RIKO, Inc.). After loading and evacuation, N2 gas was introduced at a flow rate of 100 sccm to achieve a pressure of 1 atm. The temperature was increased to 150°C at 2°C s− 1, held for 60 s, then further increased to 600°C at 10°C s− 1 and maintained for 1–10-min. After annealing, the samples were naturally cooled to 80°C under a N2 atmosphere prior to removal.
TEM, ED, and EDX measurements
Transmission electron microscopy (TEM), electron diffraction (ED), and energy-dispersive X-ray spectroscopy (EDX) analyses were outsourced to Sumika Chemical Analysis Service Ltd. (SCAS). An ARM200F (JEOL Ltd.) was used for the TEM and ED measurements, and a JED-2300T (JEOL Ltd.) detector was employed for the EDX analysis. Sample preparation was performed using a focused ion beam (FIB) system. TEM images and ED measurements were acquired at an accelerating voltage of 200 kV.
Grazing Incidence X-ray Diffraction
Grazing incidence X-ray diffraction (GI-XRD) was performed using an X'Pert3 MRD system (Malvern Panalytical Ltd.) to analyze the structure of the thin films. Monochromatic CuKα1 radiation (λ = 1.54059 Å), which was selected with a Ge(220) two-crystal monochromator, was used for the measurements. All measurements were performed at room temperature.
Microfabrication
The samples for the ferroelectric property measurements were microfabricated using the following process. After annealing, the 2-inch samples were cleaned with diluted hydrofluoric acid. Aluminum (100 nm) and TiN (10 nm) films were sequentially deposited using a sputtering system. The photoresist was then applied and patterned into 100 µm × 100 µm squares. The top TaN, Al, and TiN electrodes were etched using Cl2/BCl3 in an inductively coupled plasma etching system (RIE-101iPHS-L, Samco Inc.), followed by O2 ashing. The photoresist was subsequently removed using a remover, and the samples were cleaned and dried.
Ferroelectric Characterization
Ferroelectric properties—including P–E hysteresis loops, I–V curves, positive-up-negative-down (PUND) measurements, and endurance characteristics—were evaluated using a ferroelectric tester (FCE10-S, TOYO Corporation). The polarization values for the endurance characteristics were obtained from the remanent polarization measured by the PUND method. The measurements were conducted with the electric field direction defined as positive when a positive voltage was applied to the top electrode. The P–E hysteresis, I–V curves, PUND measurements, and endurance characteristics were measured using the pulse sequence shown in the Supporting Information section 5. All measurements were performed at room temperature.
X-ray Photoelectron Spectroscopy
X-ray photoelectron spectroscopy (XPS) measurements were outsourced to the nanoprocessing facility, which is a shared facility at the National Institute of Advanced Industrial Science and Technology (AIST). XPS measurements were performed on the same samples used for grazing incidence X-ray diffraction. The measurements were conducted using a PHI-GENESIS system (ULVAC-PHI, Inc.) with monochromatic Al Kα radiation as the X-ray source. For depth profile analysis, Ar ion sputtering was employed to etch the film. All measurements were performed at room temperature.
A
Data Availability Statement
Data supporting the results of this study are available from the corresponding author upon reasonable request and with the consent of the relevant organization.
Acknowledgements
A part of this work was supported by the "Advanced Research Infrastructure for Materials and Nanotechnology in Japan (ARIM)" of the Ministry of Education, Culture, Sports, Science and Technology (MEXT). Grant numbers JPMXP1222AT0146, JPMXP1223AT0095, JPMXP1224AT0157, and JPMXP1225AT0153. A part of this work was conducted at the AIST Nanoprocessing Facility (AIST-NPF). This work was partly supported by Kakenhi Grants-in-Aid (No. 20H02445) from the Japan Society for the Promotion of Science (JSPS) and the Japan–Taiwan Collaboration Research Program (No. JPMJKB1903) of the Infrastructure Development for Promoting International S&T Cooperation from the Japan Science and Technology Agency (JST). We also express our gratitude to the staff at SCAS for capturing the excellent TEM images and to the personnel at NPF who conducted the XPS measurements.
Author Contributions
S.A. and S.M. conceived and designed the research. S.H. fabricated the thin films. H.O., Y.M., and S.M. carried out the fabrication of the micropatterns and the establishment of processing procedures. S.A. performed the electrical measurements with reference to the advice of H.O., Y.M., and S.M. S.A. conducted the XRD measurements. S.A. engaged in discussions and gave instructions to SCAS regarding STEM observations and NPF regarding XPS measurements. S.H. and S.A. performed the analysis of the electron diffraction patterns. S.A., H.O., Y.M., S.H., and S.M. interpreted the measurement results. S.A. prepared the figures and drafted the manuscript. All the authors discussed the results and provided comments on the manuscript.
Supporting Information
Supporting Information is available for this paper.
Correspondence and requests for materials should be addressed to e-mail: shutaro-asanuma@aist.go.jp
Figures
Figure 3